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NVIDIA's Blackwell AI GPUs encounter problems

Skærmbillede 2024-08-05 103145
Translate from : NVIDIA's Blackwell AI GPU'er møder problemer
NVIDIA's upcoming Blackwell AI GPU has bigger problems, according to SemiAnalysis. This will affect production until the first half of 2025. The main problems are due to Blackwell GPU's architecture and TSMC's new CoWoS-L chip packaging.
By Maria
5 aug. 2024 10:36 am
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NVIDIA's upcoming Blackwell AI GPU family encounters "major problems" according to a new detailed review by SemiAnalysis, which will affect production targets until the first half of 2025. The main problems come from the NVIDIA Blackwell GPU architecture and the chip packaging used: TSMC's new CoWoS -L.

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SemiAnalysis explains that one of the top metal layers and bumps in the Blackwell die is rumored to be redesigned, while another is that the internal bridge dies in the CoWoS-L package will be redesigned. SemiAnalysis explains that there has been a twist in the CoWoS-L packaging that was caused by heat, with TSMC's new CoWoS-L advanced packaging being more complex than the now more common CoWoS-S packaging.

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NVIDIA's new Blackwell AI GPUs will be the first mass-market chips to use TSMC's latest CoWoS-L advanced packaging. "NVIDIA and TSMC aimed for a very aggressive ramp-up plan to produce over a million chips per quarter. Therefore, there have been a number of problems," says SemiAnalysis.

According to SemiAnalysis, NVIDIA is reportedly trying to address the issues by extending the Hopper AI GPU series and introducing a new Blackwell family GPU: the B200A. The new B200A AI GPU will be packaged using TSMC's CoWoS-S and rival packaging technologies from other vendors including Amkor, ASE and Samsung. According to SemiAnalysis, the new B200 AI GPU will meet the needs of lower and mid-range AI systems and replace the B100 and B200 chips in the HGX 8-GPU supercomputing platform form factors.

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TSMC has aggressively expanded its CoWoS-L packaging capacity to increase volume. SemiAnalysis adds that a new packaging plant named "AP6" is under construction and that the existing CoWoS-S capacity at AP3 is being converted to CoWoS-L capacity. NVIDIA's new Blackwell B200 AI GPU was supposed to launch in Q4 2024, but SemiAnalysis has a new roadmap showing the B200 shipping in "low volume" towards the end of the year (late November, December) while the B200A will arrive in Q2 2025 or Q3 2025.

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