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Samsung presents thinnest LPDDR5X DRAM

Samsung-thinnest-LPDDR5X-RAM
Translate from : Samsung præsenterer tyndeste LPDDR5X DRAM
Samsung announces mass production of the industry's thinnest 12nm LPDDR5X DRAM packages, with capacities of 12 and 16GB. These chips increase performance for high-performance applications such as AI.
By Maria
6 aug. 2024 09:57 am
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Samsung has announced mass production of the thinnest 12-nanometer (nm) LPDDR5X DRAM packages in the industry, with capacities of 12 and 16 gigabytes (GB). Leveraging its extensive expertise in chip packaging, Samsung has created ultra-thin LPDDR5X DRAM packages that maximize space within mobile devices.

This improves airflow and thermal control. Compared to the previous generation, they are approx. 9% thinner and has an improved heat resistance of 21.2%. This is important for high-performance applications with advanced features such as on-device AI.

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Through optimized printed circuit board (PCB) and epoxy mold bonding (EMC) techniques, the new LPDDR DRAM package achieves a remarkable thickness of 0.65 millimeters (mm), exceeding all existing LPDDR DRAM alternatives of 12 GB or higher.

Samsung's refined back-lapping process also minimizes the package height. Samsung aims to expand its presence in the low-power DRAM market by supplying 0.65mm LPDDR5X DRAM to both mobile processor and device manufacturers. As the demand for high-performance, high-density mobile memory solutions in compact packages continues to increase, the company plans to introduce even thinner LPDDR DRAM packages, including 6-layer 24 GB and 8-layer 32 GB modules, for future devices.

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Speaking at the presentation, YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics, said: "Samsung's LPDDR5X DRAM sets a new standard for high-performance AI solutions on devices, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package. We are committed to continuous innovation through close collaboration with our customers, and we deliver solutions that meet the needs of the low-current DRAM market."

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