NVIDIA's Blackwell AI boosts TSMC's CoWoS output

Translate from : NVIDIA's Blackwell AI øger TSMCs CoWoS output
NVIDIA's new Blackwell AI GPUs will increase demand for TSMC's advanced CoWoS packaging by over 150% by 2024.

NVIDIA's new wave of Blackwell AI GPUs is expected to boost demand for TSMC's advanced CoWoS packaging capabilities by over 150% by 2024, according to a new report from TrendForce.

The next-generation Blackwell AI GPU platform, which includes the B200 and B100 AI GPUs - as well as the GB200, which also features NVIDIA's in-house Arm-based Grace CPU - all use CoWoS packaging from TSMC. Forecasts suggest that millions of shipments of high-end B200 AI GPUs are expected by 2025, accounting for nearly 50% of NVIDIA's high-end GPU market.

NVIDIA will launch its new GB200 and B200 in the second half of 2024, where upstream wafer packaging will require a much more complex and high-precision CoWoS-L technology, which will make validation and testing more time-consuming.


In addition, more time is needed to optimize the B series for AI server systems in terms of network communication and cooling performance. TrendForce says that NVIDIA GB200 and B100 products "are not expected to see significant production volumes" until Q4 2024 or Q1 2025. NVIDIA's upcoming Blackwell-based GB200, B100 and B200 chips will increase demand for CoWoS capacity and thus see TSMC increase its overall CoWoS capacity for 2024.

Monthly capacity for CoWoS from TSMC is expected to reach 40,000 by the end of the year, a whopping 150% increase over the previous year. By 2025, total CoWoS capacity is expected to nearly double, with NVIDIA's demand for AI chips expected to account for more than half of TSMC's total CoWoS capacity.

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