Qualcomm's Snapdragon 8 Gen 4 will revolutionize smartphone SoC design by switching to custom Oryon cores and competing directly with Apple. Recent rumors suggest that it will use the same CPU cluster as MediaTek's Dimensity 9300, which means we may no longer see low-power cores on the upcoming silicon.
It has long been known that both the Snapdragon 8 Gen 4 and the Dimensity 9400 will be mass-produced on TSMC's 3nm process, specifically the Taiwanese manufacturer's 'N3E' process.
Digital Chat Station goes one step further and shares more details, including the codename of next year's flagship silicon, which is 'Sun.' He also shares that the CPU cluster will have a '2 + 6' configuration with two high-performance Phoenix cores followed by six mid-tier cores of the same name. The absence of efficiency cores may mean that the power consumption of the Snapdragon 8 Gen 4 will increase significantly compared to the Snapdragon 8 Gen 3, but TSMC's 3nm process should help in this regard.
Regardless, with just one configuration of performance cores, the Snapdragon 8 Gen 4 can achieve impressive multi-core results, and early tests reveal that the SoC's Adreno 830 GPU is faster than the Apple M2's graphics processor.
All this suggests that the Snapdragon 8 Gen 4 will be worth the wait, although Qualcomm's partners may not agree, especially when the silicon is said to be more expensive than the Snapdragon 8 Gen 3 due to the switch to the custom Oryon cores. Either way, 2024 will be exciting and we will continue to share updates with our readers.